Moldflow Analysis, Mold Filling Analysis, Mold Cooling Analysis, Part Warpage Analysis

Let us validate your electronic packaging and components for proper thermal and functional requirements, high cost multi-cavity tooling and increase your return on investment (ROI).

  • Thin wall, Insert molding, Overmolding moldflow analysis
  • FEA and thermal analysis
  • Microchip and Underfill Encapsulation

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