Many of our existing customers in electronics industry requested us to support more on product development of embedded technologies, we are expanding our services from engineering simulation, CFD, thermal analysis of electronics products to full product development and engineering services. In order to take care of additional work and additional talent needed, we have formed a joint venture with SPJ Embedded Technologies Pvt Ltd India company. Combined together, we are now able to offer complete services for electronics industry.
Any, many or all of the “product development life cycle” activities:
Let us validate your electronic packaging and components for proper thermal and functional requirements, high cost multi-cavity tooling and increase your return on investment (ROI).
We continue to offer thin wall analysis, insert molding, overmolding analysis,
FEA, thermal analysis
microchip and underfill encapsulation